Trenton Systems HDEC BackplanesTrenton Systems recently introduced four new High Density Embedded Computing or HDEC® Series backplanes that increase the support for native PCI Express 3.0 lanes by 300% compared to PICMG 1.3 backplanes.  These next generation backplanes take full advantage of the eighty (80) PCI Express 3.0 interfaces and expanded device I/O interconnects provided by an HDEC Series® system host board. Utilizing the eighty native PCIe Gen3 interfaces from an HDEC Series SHB; such as the Trenton HEP8225, increases an embedded computer’s data throughput, while lowering data latencies.  The table below contains a short specification summary of Trenton’s first four HDEC Series backplanes:

Backplane Model





Card Slots Supported

1 – SHB, 4 – x16 PCIe

1 – SHB, 4 – x16, 1 – x8 PCIe

1 – SHB, 4 – x16, 4 – x4 PCIe

4 – SHB, 4 – x16 PCIe


14.6″/371mm x 3.3″/84mm

7.9″/201mm x 12.9″/328mm

12.3″/312mm x 12.9″/328mm

16.4″/417mm x 12.9″/328mm

Target chassis

2U Rackmount Computer

Shoebox or 2-in1, 5U Rackmount

4U Rackmount Computer

4-in-1, 5U Rackmount Computer

All of the PCI Express plug-in card slots on the Trenton HDEC Series backplanes support Gen3 cards electrically and x16 PCIe Cards mechanically. In addition, these card slots fully support automatic link negotiation that enables support for x1, x4, x8 and x16 PCIe plug-in cards having PCIe 1.1, 2.0 or 3.0 interface implementations. A full five-year factory warranty and extended product availability of seven years or more comes standard with Trenton backplanes.

HDEC Series backplanes represent the next logical progression in edge-card computing technology. HDEC Series backplanes build on the basic goodness of PICMG® 1.3 backplane technologies to enable faster system MTTRs and expanded support for industry standard PCI Express plug-in cards. HDEC Series backplanes are available in a number of different form factors. These backplanes are easily integrated into standard rackmount computer chassis or into custom enclosures designed for embedding inside a machine.

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There are a number of different processor options to choose from when using Trenton’s new HDEC Series® system host board called the HEP8225.  How do you select the right one for your specific application?

The HEP8225 system host board offers a number Intel® Xeon® E5-2600 v3 Series Processor options to choose from for high density embedded computing applications. All the processor options have a 5-7 year availability horizon, all have Intel® Hyper-Threading, and all have more processor cores than every before.  This summary table of processor attributes may prove useful when making your selection for the HEP8225 board:

Intel Brand Name Cores Nominal
Core Speed
Cache Max DDR4
QPI (2) Max TDP
Intel Xeon E5-2680 v3 12 2.5GHz 30MB DDR4-2133 9.6GT/s 120W
Intel Xeon E5-2658 v3 12 2.2GHz 30MB DDR4-2133 9.6GT/s 105W
Intel Xeon E5-2648L v3 12 1.8GHz 30MB DDR4-2133 9.6GT/s 75W
Intel Xeon E5-2628L v3 10 2.0GHz 25MB DDR4-1866 8.0GT/s 75W
Intel Xeon E5-2618L v3 8 2.3GHz 20MB DDR4-1866 8.0GT/s 75W
Intel Xeon E5-2608L v3 6 2.0GHz 15MB DDR4-1600 6.4GT/s 50W

Benchmarking test criteria are also available for the processors utilized on the HEP8225 HDEC Series system host board.  Contact us to learn more and to discuss the parameters for your high density embedded computing applications. 

trenton_hep8225_hdec_system_host_board_io_plateHEP8225 HDEC Series System Host Board

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Micron-Intel Dramatically Increase NAND Storage Capacity

by Jim Renehan March 17, 2015

Density has been a critical factor in the development of all memory products, resulting in ever-increasing storage capacities within a fixed physical footprint, and with their recent announcement, Micron and Intel have considerably upped the stakes when it comes to NAND technology. Set to roll out toward the end of 2015, their new 3D NAND […]

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HDEC leverages the Power of PCI Express Gen3 I/O Bandwidth

by Jim Renehan February 20, 2015

Trenton Systems has long been recognized as the leader in PICMG backplane and single board computer technology, designing and building our board-level products with Made-in-USA quality while also offering world-class support along side an unprecedented 5-year factory warranty. On the performance front there’s been a long list of improvements over the past 10 years, with processors increasing the […]

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Will IEMI Become a Bigger Threat Than Computer Hacking?

by Jim Renehan February 6, 2015

The newswires have been buzzing a lot these days with reports of security breaches – we even mentioned incidents at Target, Sony & Home Depot in a recent blog post on password protection – caused by hackers around the globe seeking to obtain confidential corporate and financial information.  As damaging as those intrusions can be, would bringing […]

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Trenton Systems Introduced HDEC @ RTECC Santa Clara 2015

by Jim Renehan January 23, 2015

This year’s RTECC (Real-Time and Embedded Computing Conference) show in Santa Clara drew over 1,000 attendees, featured a pair of insightful keynote talks, and became the launchpad for Trenton Systems new HDEC (High Density Embedded Computing) product line. If you don’t recall seeing mention of any HDEC products on the Trenton Systems website, that’s because we’re […]

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