Density has been a critical factor in the development of all memory products, resulting in ever-increasing storage capacities within a fixed physical footprint, and with their recent announcement, Micron and Intel have considerably upped the stakes when it comes to NAND technology.

Set to roll out toward the end of 2015, their new 3D NAND technology will stack flash cells vertically to create a new level of density, allowing 2.5″ Solid State Drives to achieve 10 terabyte or greater capacity.

 Intel Micron 3D NAND 32 Layer Stack

This 3D NAND technology has the potential to create fundamental market shifts,” said Brian Shirley, vice president of Memory Technology and Solutions at Micron Technology. “The depth of the impact that flash has had to date — from smartphones to flash-optimized supercomputing — is really just scratching the surface of what’s possible.

The arrival of this architecture is well-timed, as planar NAND flash memory has little room for improvement while the need for onboard and offline data storage continues to increase.  According to Intel and Micron, 3D NAND will provide better cost efficiency and low power usage while improving latency and longevity.  Expect to see a diverse range of applications, from mobile devices to desktop computers and data centers, roll out over the next 12 months.

This technology will also find a home in both big data and supercomputing environments, as the increase in density and performance will satisfy the need for mass data storage and real-time analysis.

Intel’s development efforts with Micron reflect our continued commitment to offer leading and innovative non-volatile memory technologies to the marketplace,” said Rob Crooke, senior vice president and general manager, Non-Volatile Memory Solutions Group, Intel Corporation. “The significant improvements in density and cost enabled by our new 3D NAND technology innovation will accelerate solid-state storage in computing platforms.

More Information at the Intel Newsroom

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Trenton Systems has long been recognized as the leader in PICMG backplane and single board computer technology, designing and building our board-level products with Made-in-USA quality while also offering world-class support along side an unprecedented 5-year factory warranty.

On the performance front there’s been a long list of improvements over the past 10 years, with processors increasing the number of cores available and hard drive density continuing to climb.  For example, Trenton’s new HDEC Series will support Intel® Xeon® E5-2600 v3 Series processors with up to 14 cores (Haswell-EP).

As important as CPU processing power and data storage are to overall system performance, in the worlds of industrial automation, communications, video processing and defense applications the limiting factor is most often I/O bandwidth; another area in which the HDEC (High Density Embedded Computing) platform excels.

HDEC Series Backplane

Base Clock Speed
PCIe 3.0 = 8.0GHz
PCIe 2.0 = 5.0GHz
PCIe 1.1 = 2.5GHz
Data Rate
PCIe 3.0 = 1000MB/s
PCIe 2.0 = 500MB/s
PCIe 1.1 = 250MB/s
Total Bandwidth
PCIe 3.0 = 32GB/s
PCIe 2.0 = 16GB/s
PCIe 1.1 = 8GB/s
Data Transfer Rate
PCIe 3.0 = 8.0GT/s
PCIe 2.0= 5.0GT/s
PCIe 1.1 = 2.5GT/s

 

HDEC Series Backplane Connections

New high density PCI Express standard edge connectors featured on the HEP8225 HDEC Series system host board provide the largest PCI Express 3.0 I/O pipe available to maximize data throughput and bandwidth.

 

Two rows of PCIe Card edge fingers more than double the PCIe contact density to deliver 960 total contacts to the backplane, enabling eighty lanes of PCI Express 3.0 connectivity to high performance I/O cards.  The HDEC Series is a revolutionary leap in capability for standard 19 inch rackmount computers, increasing I/O bandwidth for critical applications such as video processing, communications, and GPU computing.

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Will IEMI Become a Bigger Threat Than Computer Hacking?

by Mark Lovett February 6, 2015

The newswires have been buzzing a lot these days with reports of security breaches – we even mentioned incidents at Target, Sony & Home Depot in a recent blog post on password protection – caused by hackers around the globe seeking to obtain confidential corporate and financial information.  As damaging as those intrusions can be, would bringing […]

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by Mark Lovett January 23, 2015

This year’s RTECC (Real-Time and Embedded Computing Conference) show in Santa Clara drew over 1,000 attendees, featured a pair of insightful keynote talks, and became the launchpad for Trenton Systems new HDEC (High Density Embedded Computing) product line. If you don’t recall seeing mention of any HDEC products on the Trenton Systems website, that’s because we’re […]

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by Mark Lovett January 12, 2015

In the early days of the internet we only needed one password – the one that we used to log on to our dial-up internet service provider.  But in the last 20 years (Netscape Navigator, still in beta, became available on October 13, 1994) the need for passwords has exploded due to online commerce (purchases and […]

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It Was Another Amazing Year For Trenton Systems

by Mark Lovett December 31, 2014

Trenton Systems has always prided itself on being an engineering company.  Not satisfied with integrating third party products, we still design and manufacture a full line of single board computers and PCI Express backplanes that end up in our customer-driven computing solutions. In 2014 we introduced a variety of new board-level products and fully integrated systems, […]

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